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BSM300GA120DLC

MODULE-5 POWER SEMICONDUCTOR DEVICE

Quantity Unit Price(USD) Ext. Price
1 $399.216 $399.22
200 $154.491 $30,898.20
500 $149.063 $74,531.50
1000 $146.379 $146,379.00

Inventory:8,551

*The price is for reference only.
  • 90-day after-sales guarantee
  • 365 Days Quality Guarantee
  • Genuine Product Guarantee
  • 7*24 hours service quarantee

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Submit your quote request for BSM300GA120DLC using this form.You can also reach us via email at Email: [email protected], and we will respond within 12 hours.

Overview of BSM300GA120DLC

In conclusion, the BSM300GA120DLC power module stands as a testament to technological innovation and reliability. Its high-power capabilities, efficient operation, and comprehensive protection features make it a go-to option for industrial and automotive applications, offering unparalleled performance and peace of mind for system designers and engineers. With its ability to seamlessly integrate into existing systems, the BSM300GA120DLC sets a new benchmark for power module versatility and performance

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Package Tray Product Status Obsolete
Configuration Single Voltage - Collector Emitter Breakdown (Max) 1200 V
Current - Collector (Ic) (Max) 570 A Power - Max 2250 W
Vce(on) (Max) @ Vge, Ic 2.6V @ 15V, 300A Current - Collector Cutoff (Max) 5 mA
Input Capacitance (Cies) @ Vce 22 nF @ 25 V Input Standard
NTC Thermistor No Operating Temperature -40°C ~ 125°C
Mounting Type Chassis Mount Package / Case Module
Supplier Device Package Module Base Product Number BSM300

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

  • Shipping and Package

    Shipping:For example, FedEx, JP, UPS, DHL,SAGAWA, or YTC.

    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

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