STM32F429VIT6

The STM32F427xx and STM32F429xx devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 180 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.The STM32F427xx and STM32F429xx devices incorporate high-speed embedded memories (Flash memory up to 2 Mbyte, up to 256 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.STM32 Nucleo-144 development board with STM32F42...Evaluation board with STM32F439NI MCU...ST-LINK/V2 in-circuit debugger/programmer for ST...Evaluation board with STM32F429NI MCU...Discovery kit with STM32F407VG MCU * New order c...

Key Features

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
  • Up to 2 MB of Flash memory organized into two banks allowing read-while-write
  • Up to 256+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, Compact Flash/NOR/NAND memories
• LCD parallel interface, 8080/6800 modes
• LCD-TFT controller with fully programmable resolution (total width up to 4096 pixels, total height up to 2048 lines and pixel clock up to 83 MHz)
• Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D)
• Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC (1% accuracy)
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
  • Sleep, Stop and Standby modes
  • V_BAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM
• Low power
  • Sleep, Stop and Standby modes
  • V_BAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
• Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
• Debug mode
  • SWD & JTAG interfaces
  • Cortex-M4 Trace Macrocell™
• Up to 168 I/O ports with interrupt capability<