• LCMXO640C-3FTN256C CSBGA-256
LCMXO640C-3FTN256C CSBGA-256

LCMXO640C-3FTN256C

CPLD MachXO Family 320 Macro Cells 1.8V/2.5V/3.3V 256-Pin FTBGA Tray

Quantity Unit Price(USD) Ext. Price
1 $18.913 $18.91
200 $7.319 $1,463.80
500 $7.062 $3,531.00
1000 $6.935 $6,935.00

Inventory:7,017

*The price is for reference only.
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Please submit RFQ for LCMXO640C-3FTN256C or email to us: Email: [email protected], we will contact you in 12 hours.

Overview of LCMXO640C-3FTN256C

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA

LCMXO640C-3FTN256C

Key Features

  • Non-volatile, Infinitely Reconfigurable
  • Instant-on – powers up in microseconds
  • Single chip, no external configuration memory
  • required
  • Excellent design security, no bit stream to
  • intercept
  • Reconfigure SRAM based logic in milliseconds
  • SRAM and non-volatile memory programmable
  • through JTAG port
  • Supports background programming of
  • non-volatile memory
  • Sleep Mode
  • Allows up to 100x static current reduction
  • TransFR™ Reconfiguration (TFR)
  • In-field logic update while system operates
  • High I/O to Logic Density
  • 256 to 2280 LUT4s
  • 73 to 271 I/Os with extensive package options
  • Density migration supported
  • Lead free/RoHS compliant packaging
  • Embedded and Distributed Memory
  • Up to 27.6 Kbits sysMEM™ Embedded Block
  • RAM
  • Up to 7.5 Kbits distributed RAM
  • Dedicated FIFO control logic
  • Flexible I/O Buffer
  • Programmable sysIO™ buffer supports wide
  • range of interfaces:
  • − LVCMOS 3.3/2.5/1.8/1.5/1.2
  • − LVTTL
  • − PCI
  • − LVDS, Bus-LVDS, LVPECL, RSDS
  • sysCLOCK™ PLLs
  • Up to two analog PLLs per device
  • Clock multiply, divide, and phase shifting
  • System Level Support
  • IEEE Standard 1149.1 Boundary Scan
  • Onboard oscillator
  • Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
  • power supply
  • IEEE 1532 compliant in-system programming
Lattice Semiconductor Corporation Inventory

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer LATTICE SEMICONDUCTOR CORP
Part Package Code BGA Package Description FTBGA-256
Pin Count 256 Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor JESD-30 Code S-PBGA-B256
JESD-609 Code e1 Length 17 mm
Moisture Sensitivity Level 3 Number of CLBs 80
Number of Inputs 159 Number of Logic Cells 640
Number of Outputs 159 Number of Terminals 256
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 80 CLBS Package Body Material PLASTIC/EPOXY
Package Code LBGA Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 Power Supplies 1.8/2.5/3.3 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY Qualification Status Not Qualified
Seated Height-Max 1.7 mm Supply Voltage-Max 3.465 V
Supply Voltage-Min 1.71 V Supply Voltage-Nom 1.8 V
Surface Mount YES Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Terminal Form BALL
Terminal Pitch 1 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 Width 17 mm

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