XCZU9CG-2FFVB1156I

Name: XCZU9CG-2FFVB1156I
Brand: Xilinx
Rating: 4.5 (10 reviews)

SoC FPGA XCZU9CG-2FFVB1156I

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Part Number : XCZU9CG-2FFVB1156I
Package/Case : FCBGA-1156
Brands : Xilinx
Components Categories : System On Chip
Datesheet : XCZU9CG-2FFVB1156I DataSheet (PDF)

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Overview of XCZU9CG-2FFVB1156I

The XCZU9CG-2FFVB1156I's packaging design, featuring a 1156-pin flip-chip package with a fine pitch ball grid array, is optimized for efficient performance. Operating on a 1.0V core voltage and 1.8V I/O voltage, this device is designed to deliver reliable operation across a range of temperatures, from -40°C to 100°C. Whether used in industrial, automotive, or aerospace applications, this MPSoC CG device is up to the task, offering unparalleled performance and versatility

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category	SoC FPGA	Shipping Restrictions	This product may require additional documentation to export from the United States.
RoHS	Details	Mounting Style	SMD/SMT
Package / Case	FCBGA-1156	Core	ARM Cortex A53, ARM Cortex R5
Number of Cores	4 Core	Maximum Clock Frequency	600 MHz, 1.5 GHz
L1 Cache Instruction Memory	2 x 32 kB, 2 x 32 kB	L1 Cache Data Memory	2 x 32 kB, 2 x 32 kB
Number of Logic Elements	599550 LE	Adaptive Logic Modules - ALMs	34260 ALM
Embedded Memory	32.1 Mbit	Number of I/Os	352 I/O
Operating Supply Voltage	850 mV	Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 100 C	Brand	Xilinx
Distributed RAM	8.8 Mbit	Embedded Block RAM - EBR	32.1 Mbit
Moisture Sensitive	Yes	Number of Logic Array Blocks - LABs	34260 LAB
Number of Transceivers	24 Transceiver	Product Type	SoC FPGA
Series	XCZU9CG	Factory Pack Quantity	1
Subcategory	SOC - Systems on a Chip	Tradename	Zynq UltraScale+

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