• XC7Z035-1FBG676C FCBGA-676
XC7Z035-1FBG676C FCBGA-676

XC7Z035-1FBG676C

IC 7035 / XC7Z035-1FBG676C FBGA676

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Overview of XC7Z035-1FBG676C

The XC7Z035-1FBG676C is a high-performance system on chip (SoC) device from Xilinx, combining a dual-core ARM Cortex-A9 processor with programmable logic in a single chip. It offers a versatile platform for embedded applications that require both processing power and programmable logic capabilities.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDDINT: Internal core voltage supply
  • VADJ: Analog supply voltage adjustment
  • VCCO_34: Configurable I/O voltage level
  • GND: Ground
  • VCCPINT: PS internal core voltage supply
  • MGTYAVCC: GTY transceiver supply voltage positive
  • MGTYAVTT: GTY transceiver supply voltage termination
  • PS_MIO[9]: Multiplexed I/O signal
  • PS_MIO[10]: Multiplexed I/O signal
  • EMIO[0]: Extended multiplexed I/O signal
  • EMIO[1]: Extended multiplexed I/O signal
  • PL_IO[0]: Programmable logic I/O signal
  • PL_IO[1]: Programmable logic I/O signal

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the XC7Z035-1FBG676C SoC for a visual representation.

Key Features

  • Dual-Core ARM Cortex-A9 Processor: Provides powerful processing capabilities for embedded applications.
  • Programmable Logic: Includes Xilinx's programmable logic fabric for custom hardware acceleration.
  • High-Speed Transceivers: Features high-speed transceivers for interfacing with external devices.
  • FPGA Configuration: Supports dynamic reconfiguration of the FPGA fabric for versatility in design implementations.
  • DDR Memory Interface: Integrated DDR memory controller for efficient memory access.
  • System-Level Integration: Enables seamless integration of software and hardware components in a single chip.

Note: For detailed technical specifications, please refer to the XC7Z035-1FBG676C datasheet.

Application

  • Embedded Systems: Ideal for embedded system designs requiring a combination of processing power and FPGA customization.
  • Signal Processing: Suitable for applications involving high-speed data processing and signal manipulation.
  • Industrial Automation: Used in industrial automation systems for control, monitoring, and communication tasks.

Functionality

The XC7Z035-1FBG676C integrates dual-core ARM processing with FPGA programmable logic to provide a comprehensive solution for embedded applications requiring both hardware and software flexibility.

Usage Guide

  • Power Supply: Ensure proper power connections for VDDINT, VADJ, VCCO_34, and other specified power pins.
  • I/O Configuration: Configure the I/O pins based on the interfacing requirements of the application.

Frequently Asked Questions

Q: Can the XC7Z035-1FBG676C support real-time processing tasks?
A: Yes, the dual-core ARM Cortex-A9 processors offer real-time processing capabilities suitable for various applications.

Q: Is the XC7Z035-1FBG676C suitable for high-bandwidth communication applications?
A: With high-speed transceivers and FPGA flexibility, the XC7Z035-1FBG676C is well-suited for high-bandwidth communication tasks.

Equivalent

For similar functionalities, consider these alternatives to the XC7Z035-1FBG676C:

  • XC7Z020-1FBG676C: Another member of the Xilinx Zynq-7000 SoC family offering similar features with a different resource distribution.
  • Altera Cyclone V: A comparable FPGA-based SoC from Altera with dual-core ARM Cortex-A9 and FPGA fabric integration.

XC7Z035-1FBG676C

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XC7Z035 Product Status Active
Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Operating Temperature 0°C ~ 85°C (TJ)
Package / Case FCBGA-676 Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130 Base Product Number XC7Z035
Manufacturer Xilinx Product Category SoC FPGA
RoHS Details Mounting Style SMD/SMT
Core ARM Cortex A9 Number of Cores 2 Core
Maximum Clock Frequency 667 MHz L1 Cache Instruction Memory 2 x 32 kB
L1 Cache Data Memory 2 x 32 kB Number of Logic Elements 275000 LE
Adaptive Logic Modules - ALMs 42975 ALM Embedded Memory 17.6 Mbit
Number of I/Os 250 I/O Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Brand Xilinx
Moisture Sensitive Yes Number of Logic Array Blocks - LABs 21487.5 LAB
Product Type Processors - Application Specialized Subcategory SOC - Systems on a Chip
Tradename Zynq

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