WP3232M5NHEI-320B2

This third generation ofWinPath® products builds upon hundreds of successful customer communicationssystem deployments and leverages the broad set of supplied protocols developedfor WinPath1 and WinPath2. These protocols include support for L2 and L3termination (including Ethernet, ML-PPP, IMA, CES), PWE3 (for Ethernet, TDM,HDLC, ATM), Packet Network Synchronization (IEEE 1588v2, Synchronous Ethernet,adaptive and differential clock recovery), interworking (MPLS, IPv4/IPv6Routing, VLAN-aware bridging), OAM (for Ethernet and ATM), QoS (policing,shaping, per-flow queuing, WRED) and many others.

WinPath3 integrates control plane and enhanceddata plane processing components. Control plane processing is based on two highperformance MIPS 34K multi-threaded processors.

Data plane processing uses new hardwareaccelerators for packet classification, hierarchical shaping, additionalsecurity standards and more which have been added to off-load common processingtasks. These accelerators are flexibly combined with Microsemi's field-proven,fully-programmable, high performance, multi-threaded WinComm multi-core datapath processor subsystem. The available number of cores in WinComm hasincreased from six to twelve along with increases in operating speed.

Key Features

• 12 RISC processors and 64 concurrent hardware threads processing at up to 450 MHz
• Dual multi-threaded MIPS 34Kc® cores at 650MHz with L1 and L2 caches
• 3 level hierarchical shaper with 16K Flows with WRED accelerators
• 16x GbE and Two 10GbE MACs
• 14 multi-standard SERDES lanes
• 16 TDI supporting T1/E1/T3/E3 or CT/MVIP bus
• 2.5MB Internal memory; 3x 16-bit / 32-bit DDR3 interfaces
• 31mm x 31mm 896 FCBGA with 1mm ball pitch