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TMS320C6202GLS250

Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc

Quantity Unit Price(USD) Ext. Price
1 $263.893 $263.89
200 $102.123 $20,424.60
500 $98.535 $49,267.50
1000 $96.763 $96,763.00

Inventory:7,102

*The price is for reference only.
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Overview of TMS320C6202GLS250

The TMS320C6202GLS250 is a digital signal processor (DSP) IC that is part of the Texas Instruments TMS320C62x DSP generation. It features a clock speed of 250MHz and is designed for high-performance signal processing applications. This DSP offers advanced computational capabilities and is ideal for applications requiring real-time processing and high-speed data manipulation.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDD: Digital Supply Voltage
  • AVDD: Analog Supply Voltage

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the TMS320C6202GLS250 DSP for a visual representation.

Key Features

  • High-Speed Clock: Operates at a clock speed of 250MHz, enabling fast signal processing.
  • DSP Architecture: Features a specialized DSP architecture optimized for digital signal processing tasks.
  • Multiple Supply Voltages: Supports multiple supply voltages for digital and analog domains.
  • On-Chip Memory: Includes on-chip memory for storing program instructions and data.
  • Peripheral Interfaces: Offers various peripheral interfaces for connectivity and data exchange.

Note: For detailed technical specifications, please refer to the TMS320C6202GLS250 datasheet.

Application

  • Telecommunications: Suitable for telecommunication systems requiring signal processing capabilities.
  • Audio Processing: Used in audio processing applications such as speech recognition and audio enhancement.
  • Industrial Automation: Ideal for industrial automation systems for real-time control and monitoring.

Functionality

The TMS320C6202GLS250 is a high-performance DSP designed for demanding signal processing tasks. It offers efficient computation and processing capabilities for various applications.

Usage Guide

  • Power Supply: Connect the appropriate supply voltages to the VDD and AVDD pins for digital and analog power.
  • Data Bus: Utilize the data bus pins for transferring data between the DSP and external components.
  • Clock Output: Use the CLKOUT pin to monitor the clock signal or for synchronization purposes.

Frequently Asked Questions

Q: Can the TMS320C6202GLS250 be overclocked for higher performance?
A: The TMS320C6202GLS250 is designed to operate at 250MHz. Overclocking may lead to instability and is not recommended.

Q: Is the TMS320C6202GLS250 suitable for real-time image processing applications?
A: Yes, the TMS320C6202GLS250 is well-suited for real-time image processing tasks due to its high-speed processing capabilities.

Equivalent

For similar functionalities, consider these alternatives to the TMS320C6202GLS250:

  • TMS320C6201GLS200: A lower clock speed version of the TMS320C6202GLS250 offering similar DSP capabilities.
  • TMS320C6203GLS300: A higher clock speed variant with enhanced performance for more demanding applications.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Source Content uid TMS320C6202GLS250 Pbfree Code Yes
Rohs Code No Part Life Cycle Code Not Recommended
Ihs Manufacturer TEXAS INSTRUMENTS INC Part Package Code BGA
Package Description HFBGA, BGA384,22X22,32 Pin Count 384
Reach Compliance Code not_compliant ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 Date Of Intro 1998-08-01
Samacsys Manufacturer Texas Instruments Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 22 Barrel Shifter NO
Bit Size 32 Boundary Scan YES
Clock Frequency-Max 250 MHz External Data Bus Width 32
Format FIXED POINT Integrated Cache YES
Internal Bus Architecture MULTIPLE JESD-30 Code S-PBGA-B384
JESD-609 Code e0 Length 18 mm
Low Power Mode YES Moisture Sensitivity Level 4
Number of DMA Channels 4 Number of External Interrupts 4
Number of Terminals 384 Number of Timers 2
On Chip Data RAM Width 8 On Chip Program ROM Width 8
Operating Temperature-Max 90 °C Operating Temperature-Min
Package Body Material PLASTIC/EPOXY Package Code HFBGA
Package Equivalence Code BGA384,22X22,32 Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, FINE PITCH Peak Reflow Temperature (Cel) 220
Power Supplies 1.8,3.3 V Qualification Status Not Qualified
RAM (words) 32768 ROM Programmability MROM
Seated Height-Max 2.8 mm Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V Supply Voltage-Nom 1.8 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish TIN LEAD
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 20
Width 18 mm uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

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