TMS320C6202GLS250
Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Proc
Quantity | Unit Price(USD) | Ext. Price |
---|---|---|
1 | $263.893 | $263.89 |
200 | $102.123 | $20,424.60 |
500 | $98.535 | $49,267.50 |
1000 | $96.763 | $96,763.00 |
Inventory:7,102
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Part Number : TMS320C6202GLS250
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Package/Case : FCBGA-384
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Brands : TI
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Components Categories : DSP (Digital Signal Processors)
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Datesheet : TMS320C6202GLS250 DataSheet (PDF)
The TMS320C6202GLS250 is a digital signal processor (DSP) IC that is part of the Texas Instruments TMS320C62x DSP generation. It features a clock speed of 250MHz and is designed for high-performance signal processing applications. This DSP offers advanced computational capabilities and is ideal for applications requiring real-time processing and high-speed data manipulation. (Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.) Include a circuit diagram illustrating the connections and operation of the TMS320C6202GLS250 DSP for a visual representation. Note: For detailed technical specifications, please refer to the TMS320C6202GLS250 datasheet. Functionality The TMS320C6202GLS250 is a high-performance DSP designed for demanding signal processing tasks. It offers efficient computation and processing capabilities for various applications. Usage Guide Q: Can the TMS320C6202GLS250 be overclocked for higher performance? Q: Is the TMS320C6202GLS250 suitable for real-time image processing applications? For similar functionalities, consider these alternatives to the TMS320C6202GLS250:Overview of TMS320C6202GLS250
Pinout
Circuit Diagram
Key Features
Application
Frequently Asked Questions
A: The TMS320C6202GLS250 is designed to operate at 250MHz. Overclocking may lead to instability and is not recommended.
A: Yes, the TMS320C6202GLS250 is well-suited for real-time image processing tasks due to its high-speed processing capabilities.Equivalent
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Source Content uid | TMS320C6202GLS250 | Pbfree Code | Yes |
Rohs Code | No | Part Life Cycle Code | Not Recommended |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | Part Package Code | BGA |
Package Description | HFBGA, BGA384,22X22,32 | Pin Count | 384 |
Reach Compliance Code | not_compliant | ECCN Code | 3A991.A.2 |
HTS Code | 8542.31.00.01 | Date Of Intro | 1998-08-01 |
Samacsys Manufacturer | Texas Instruments | Additional Feature | ALSO REQUIRES 3.3V SUPPLY |
Address Bus Width | 22 | Barrel Shifter | NO |
Bit Size | 32 | Boundary Scan | YES |
Clock Frequency-Max | 250 MHz | External Data Bus Width | 32 |
Format | FIXED POINT | Integrated Cache | YES |
Internal Bus Architecture | MULTIPLE | JESD-30 Code | S-PBGA-B384 |
JESD-609 Code | e0 | Length | 18 mm |
Low Power Mode | YES | Moisture Sensitivity Level | 4 |
Number of DMA Channels | 4 | Number of External Interrupts | 4 |
Number of Terminals | 384 | Number of Timers | 2 |
On Chip Data RAM Width | 8 | On Chip Program ROM Width | 8 |
Operating Temperature-Max | 90 °C | Operating Temperature-Min | |
Package Body Material | PLASTIC/EPOXY | Package Code | HFBGA |
Package Equivalence Code | BGA384,22X22,32 | Package Shape | SQUARE |
Package Style | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | Peak Reflow Temperature (Cel) | 220 |
Power Supplies | 1.8,3.3 V | Qualification Status | Not Qualified |
RAM (words) | 32768 | ROM Programmability | MROM |
Seated Height-Max | 2.8 mm | Supply Voltage-Max | 1.89 V |
Supply Voltage-Min | 1.71 V | Supply Voltage-Nom | 1.8 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Finish | TIN LEAD |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 20 |
Width | 18 mm | uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
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