• K9F1G08U0C-PCB0 TSOP-I
K9F1G08U0C-PCB0 TSOP-I

K9F1G08U0C-PCB0

TSOP-I 48-Pin Package

Inventory:8,238

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  • Part Number : K9F1G08U0C-PCB0

  • Package/Case : TSOP-I

  • Brands : Samsung Electronics

  • Components Categories : Flash Memories

  • Datesheet : K9F1G08U0C-PCB0 DataSheet (PDF)

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Overview of K9F1G08U0C-PCB0

The K9F1G08U0C-PCB0 is a 1 Gbit NAND Flash memory chip manufactured by Samsung. It is designed for use in various electronic devices such as smartphones, tablets, digital cameras, and solid-state drives. This memory chip offers a high storage capacity of 1 Gbit or 128 MB, making it suitable for storing large amounts of data and media files.The K9F1G08U0C-PCB0 uses NAND Flash technology, which provides fast data transfer speeds and high reliability. It operates on a voltage range of 2.7V to 3.6V and features a low power consumption, making it ideal for portable devices with limited battery capacity.This memory chip has a page size of 2 KB and a block size of 64 KB, allowing for efficient data management and storage. It also supports various interface options, including Toggle and ONFI, for seamless integration with different types of devices.

K9F1G08U0C-PCB0

Key Features

  • K9F1G08U0C-PCB0 is a NAND Flash memory device with a capacity of 1GB
  • It uses the NAND interface for high-speed data transfer
  • It has a standard 48-pin TSOP package
  • It is designed for use in various digital devices and applications
  • It offers reliable and efficient data storage capabilities

    • Application

  • The K9F1G08U0C-PCB0 is a NAND Flash memory device commonly used in consumer electronics, automotive systems, industrial applications, and networking devices
  • It is ideal for applications requiring high-speed data transfer, reliable storage, and low power consumption

    • Specifications

    The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

    ECCN (US) 3A991.b.1.a Part Status Obsolete
    Automotive No PPAP No
    Cell Type NAND Chip Density (bit) 1G
    Architecture Sectored Boot Block No
    Block Organization Symmetrical Address Bus Width (bit) 28
    Sector Size 128Kbyte x 1024 Page Size 2Kbyte
    Number of Bits/Word (bit) 8 Number of Words 128M
    Programmability Yes Timing Type Asynchronous
    Maximum Erase Time (s) 0.01/Block Maximum Programming Time (ms) 0.7
    Interface Type Parallel Minimum Operating Supply Voltage (V) 2.7
    Typical Operating Supply Voltage (V) 3.3 Maximum Operating Supply Voltage (V) 3.6
    Operating Current (mA) 30 Page Read Current (mA) 30
    Program Current (mA) 30 Minimum Operating Temperature (°C) -10
    Maximum Operating Temperature (°C) 125 Command Compatible No
    ECC Support Yes Support of Page Mode Yes
    Mounting Surface Mount Package Height 1
    Package Width 18.4 Package Length 12
    PCB changed 48 Standard Package Name SO
    Supplier Package TSOP-I Pin Count 48
    Lead Shape Gull-wing

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