CC2674R106T0RGZR

The SimpleLink™ CC2674R10 device is a multiprotocol and multi-band 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets. The highlighted features of this device include:

• Arm TrustZone based secure key storage, device ID and trusted functions support.
• Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
• Longer battery life wireless applications with low standby current of 0.92 µA with full 256 kB RAM retention.
• Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
• Dedicated software controlled radio controller (Arm ® Cortex ®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125 kbps LE Coded PHY).

The CC2674R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs 2.4 GHz solutions, visit www.ti.com/bluetooth

Key Features

Wireless microcontroller

• Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
• FPU and DSP extension
• 1024 kB flash program memory
• 8 kB of cache SRAM
• 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
  • ­32 kB of additional SRAM is available if parity is disabled
• Dynamic multiprotocol manager (DMM) driver
• Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY and MAC
• Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

• Autonomous MCU with 4 kB of SRAM
• Sample, store, and process sensor data
• Fast wake-up for low-power operation
• Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

• MCU consumption:
  • 4.0 mA active mode, CoreMark
  • 83 µA/MHz running CoreMark
  • 1.19 µA standby mode, RTC, 256 kB RAM
  • 0.13 µA shutdown mode, wake-up on pin
• Ultra low-power sensor controller consumption:
  • 30 µA in 2 MHz mode
  • 809 µA in 24 MHz mode
• Radio consumption:
  • 6.4 mA RX at 2.4 GHz
  • 7.3 mA TX at 0 dBm at 2.4 GHz

Wireless protocol support

• Thread, Zigbee®, Matter
• Bluetooth® 5.3 Low Energy
• 6LoWPAN
• Proprietary Systems

High performance radio

• –104 dBm for Bluetooth® Low Energy 125 kbps
• –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)

Regulatory compliance

• Designed for systems targeting compliance with these standards:
  • EN 300 328, EN 300 440 Cat. 2 and 3
  • FCC CFR47 Part 15
  • ARIB STD-T66

MCU peripherals

• Most digital peripherals can be routed to any GPIO
• Four 32-bit or eight 16-bit general-purpose timers
• 12-bit SAR ADC, 200 ksps, 8 channels
• 8-bit DAC
• Two comparators
• Programmable current source
• Four UART, four SPI, two I 2C, I 2S
• Real-time clock (RTC)
• Integrated temperature and battery monitor

Security enablers

• Supports secure boot
• Supports secure key storage and device ID
• Arm TrustZone for trusted execution environment
• AES 128- and 256-bit cryptographic accelerator
• Public key accelerator
• SHA2 accelerator (full suite up to SHA-512)
• True random number generator (TRNG)
• Secure debug lock
• Software anti-rollback protection

Development tools and software

• LP-EM-CC1354P10-6 for dual-band and 10 dBm output power on 2.4 GHz
• LP-XDS110, LP-XDS110ET or TMDSEMU110-U (with TMDSEMU110-ETH add-on) Debug Probe
• SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
• SmartRF™ Studio for simple radio configuration
• Sensor Controller Studio for building low-power sensing applications
• SysConfig system configuration tool

Operating range

• On-chip buck DC/DC converter
• 1.8 V to 3.8 V single supply voltage
• –40°C to +105°C

Package

• 7 mm × 7 mm RGZ VQFN48 (31 GPIOs)
• 8 mm × 8 mm RSK VQFN64 (42 GPIOs)⁽¹⁾
• RoHS-compliant package

⁽¹⁾Information for the RSK package (8.00 mm x 8.00 mm) is preview only and subject to change.