XC3S1200E-5FTG256C
XC3S1200E-5FTG256C Field-Programmable Gate Array
Quantity | Unit Price(USD) | Ext. Price |
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1 | $429.237 | $429.24 |
180 | $171.268 | $30,828.24 |
540 | $165.546 | $89,394.84 |
990 | $162.717 | $161,089.83 |
Inventory:8,102
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Part Number : XC3S1200E-5FTG256C
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Package/Case : FBGA-256
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Brand : AMD
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Components Classification : FPGAs
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Datesheet : XC3S1200E-5FTG256C DataSheet (PDF)
The XC3S1200E-5FTG256C is a field-programmable gate array (FPGA) with a capacity of 1200 logic cells and features a -5 speed grade. It offers reconfigurable logic and high-speed performance, making it suitable for a wide range of applications. (Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.) Include a circuit diagram illustrating the connections and operation of the XC3S1200E-5FTG256C FPGA for a visual representation. Note: For detailed technical specifications, please refer to the XC3S1200E-5FTG256C datasheet. Functionality The XC3S1200E-5FTG256C FPGA offers reconfigurable logic elements that can be programmed to perform a variety of tasks, making it highly versatile for different applications. Usage Guide Q: What is the maximum logic capacity of the XC3S1200E-5FTG256C? Q: Can the FPGA be reprogrammed multiple times? For similar FPGA solutions, consider these alternatives to the XC3S1200E-5FTG256C:Overview of XC3S1200E-5FTG256C
Pinout
Circuit Diagram
Key Features
Application
Frequently Asked Questions
A: The XC3S1200E-5FTG256C has a capacity of 1200 logic cells.
A: Yes, the XC3S1200E-5FTG256C is designed for multiple reprogramming cycles, allowing for flexibility in logic design.Equivalent
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Series | XC3S1200E | Product Status | Active |
Programmabe | Not Verified | Number of LABs/CLBs | 2168 |
Number of Logic Elements/Cells | 19512 | Total RAM Bits | 516096 |
Number of I/O | 190 | Number of Gates | 1200000 |
Voltage - Supply | 1.14V ~ 1.26V | Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) | Package / Case | FBGA-256 |
Supplier Device Package | 256-FTBGA (17x17) | Base Product Number | XC3S1200 |
Manufacturer | Xilinx | Product Category | FPGA - Field Programmable Gate Array |
RoHS | Details | Number of Logic Elements | 19512 LE |
Number of I/Os | 190 I/O | Supply Voltage - Min | 1.2 V |
Supply Voltage - Max | 1.2 V | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Data Rate | 333 Mb/s |
Mounting Style | SMD/SMT | Brand | Xilinx |
Distributed RAM | 136 kbit | Embedded Block RAM - EBR | 504 kbit |
Maximum Operating Frequency | 300 MHz | Moisture Sensitive | Yes |
Operating Supply Voltage | 1.2 V | Product Type | FPGA - Field Programmable Gate Array |
Subcategory | Programmable Logic ICs | Tradename | Spartan |
Unit Weight | 0.808068 oz |
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